SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Board and Systems Assembly process & requirements;

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	Thermally Conductive Adhesive Tapes for heatsink attachment
	Fiber Laser Marking Systems and Industrial Lasers for variety of applications.
	Solder flux – No clean & water soluable as well as various other formulations
	Gold bonding wire Micro Solder ball Gold evaporate
	Wafer Level Solder Ball Placement Systems Strip Level Solder Ball Placement Systems Flip Chip Die Bonders
	Ultra High Temp (270C) Process Trays/Boats Shipping Trays (Jedec and Custom) Tape & Reel Moisture Barrier Bags
	Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
	2D and 3D Package Inspection Systems Wafer Bump Inspections Systems