SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Assembly process & requirements;

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  • Wafer Packing and Shipping Materials
  • Anti Static ESD safe Materials
  • ST-Poly Conductive Coatings
JDS Uniphase
  • Fiber Laser Marking Systems and
  • Industrial Lasers for variety of applications.
  • Solder flux – No clean & water soluable as well as various other formulations
  • Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT) For Optical and MEMS products only.
  • Solder spheres, Gold wire and Pladium coated Copper wire.

  • CMP Pad Conditioners.
  • Micro Ball Bumping for Wafer Bumping

  • Wafer Level Solder Ball Placement Systems
  • Strip Level Solder Ball Placement Systems
  • Flip Chip Die Bonders

  • Ultra High Temp (270C) Process Trays/Boats
  • Shipping Trays (Jedec and Custom)
  • Tape & Reel
  • Moisture Barrier Bags
  • Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
  • ADP Dry Etch Wafer Thinning Equipment
  • Wafer Non-Contact Handling Systems
  • Organic substrates for Flip Chip, BGA & CSP packages
  • Molding Systems (including Wafer Level Molding)
  • Trim,Form & Saw Singulation Systems
  • Pick & Place Test Handlers (Tri-Temp)
  • 2D and 3D Package Inspection Systems
  • Wafer Bump Inspections Systems
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