SunSil
is proud to represent some of the leading manufacturers in
support of Integrated Circuit Probe and Final Test process & requirements;
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Wafer
Packing and Shipping Materials
Anti
Static ESD safe Materials
ST-Poly
Conductive Coatings
Fiber
Laser Marking Systems and
Industrial
Lasers for variety of applications.
Full
turnkey Wafer Probe, Component Assembly & Final Test
Manufacturing Services (OSAT).
Ultra
High Temp (270C) Process Trays/Boats
Shipping
Trays (Jedec and Custom)
Tape & Reel
Moisture
Barrier Bags
Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
Complete
Line of Molding, Trim & Form, Saw Singulation systems,
including Wafer Level Molding. Also
the new cost effective TRI-TEMP Pick & Place Test Handlers.
