SunSil is proud to represent some of the leading manufacturers in support of Integrated Circuit Probe and Final Test process & requirements;

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  • Wafer Packing and Shipping Materials
  • Anti Static ESD safe Materials
  • ST-Poly Conductive Coatings
JDS Uniphase
  • Fiber Laser Marking Systems and
  • Industrial Lasers for variety of applications.
  • Full turnkey Wafer Probe, Component Assembly & Final Test Manufacturing Services (OSAT).

  • Ultra High Temp (270C) Process Trays/Boats
  • Shipping Trays (Jedec and Custom)
  • Tape & Reel
  • Moisture Barrier Bags
  • Full turnkey wafer probe component module assembly, and final test manufacturing sevices (OSAT)
  • Complete Line of Molding, Trim & Form, Saw Singulation systems, including Wafer Level Molding. Also the new cost effective TRI-TEMP Pick & Place Test Handlers.
  • 2D and 3D Package Inspection Systems
  • Wafer Bump Inspections Systems
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